Franklin Advanced Materials, LLC.

Address: 320 Circle of Progress Drive, Pottstown, Pennsylvania 19464, USA

Telephone Number: 01-610-323-8965

Facsimile Number: 01-610-323-8975

Email: Send Email to Franklin Advanced Materials, LLC.

Business: Manufacturers

Services: Crystalline Cell Metal Paste, Silver Paste, Aluminum Paste

Products: Crystalline Cell Metal Paste, Solar Cell Materials

Web Site: http://www.franklinadvancedmaterials.com

Franklin Advanced Materials develops and manufactures specially engineered materials for a wide range of industrial markets: photovoltaic solar cells, solid oxide fuel cells, hybrid microelectronics, multilayer microelectronics, electronic components, sensors, and other thick-film interconnect or metallization applications. We offer our products to customers around the world, providing you with custom materials development, component fabrication, and state-of-the-art testing services. In addition to industrial customers, we also offer custom materials and services to companies, universities, and labs that are engaged in research and development activities.

Franklin Advanced Materials develops and manufactures metallization pastes for crystalline solar cells. Our SunAg line of front contact pastes are engineered to deliver high cell efficiency and excellent solderability with very low material laydown. These front contact pastes are compatible with high sheet resistance P-type wafers. Pastes for N-type wafers are under development, and Franklin welcomes opportunities to collaborate in this field.

Our LunAg line of back contact silver pastes offer the lowest solids loadings in the industry, as low as 48%, and extremely high coverage, as little as 0.012 grams per cell, for extreme cost savings. All back contact silver pastes are designed to provide excellent solderability.

We also offer a back surface field (BSF) aluminum paste product, LunAl, with industry leading low bow characteristics. Despite this paste's low bow, adhesion of the aluminum paste to the wafer remains high. With such low bowing characteristics, cell manufacturers are able to increase laydown of the paste for improved BSF formation and cell performance and / or decrease wafer thickness for its cost and performance benefits.

For further information, please see our website www.FranklinAdvancedMaterials.com or contact us by email at sales@arbfc.com.

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